High-Precision Wafer Crack Inspection Device "Super Macro SM75"
Inspection in one shot for 300mm wafers in 1 second.
The high-precision wafer crack inspection device "Super Macro SM75" can inspect 300mm wafers in less than one second with a full-field one-shot, making it suitable for fully automated inspection lines due to its short inspection time. It is available with a lineup of small-field optical systems and can be applied to internal void inspections by using infrared light as an optional light source. In recent years, wafers have been becoming thinner, but this high-precision wafer crack inspection device can quickly inspect the entire wafer for chip cracks caused by the unevenness of BG processing, polishing marks, and stress. For more details, please download the catalog.
- Company：アローズエンジニアリング
- Price：Other
